PCA

ICS has been supplying flexible solutions for two decades.  Assembly and testing printed circuit boards is one of our core competencies.  ICS is a leader in high mix/low volume assembly, specializing in complex assemblies and box builds. Our success maintaining a world-class operation is though our partners as well as our NPI process. Our NPI processes has proven our ability to help our partners get to the market before the competition.  With our paperless factory model, our partners experience real-time information with the ability to make changes on the fly throughout the process.  Our Quality MES model guarantees the product will be built best in class every time.

(PCA)  Capabilities:

Surface Mount Technology  (SMT)
0201
BGA
Micro BGA
Flip Chip
CCGA
COB
CSP’s
MCM’s
MEM’s
Double sided , Mirrored BGA’s
Doubled sided reflow Processing
Fine pitch part placement down to 10 mil
Large scale assemblies up to 24” x 24”
Through Hole Placement
Radial Insertion
Axial Insertion
Dip insertion
Slide line
Press fit connectors
Terminal insertion
Large scale assemblies up to 24” x 24”
Process Chemistry
Lead Assembly
Aqueous Clean Assembly
No Clean Assembly
Lead Free Assembly
Soldering Operations
Reflow
Nitrogen Reflow
Wave Leaded
Wave Lead Free
Nitrogen Wave Lead-free
Selective Solder Lead
Selective Solder Lead free


Encapsulation operations:

 
Conformal coating line silicon
Conformal coating line acrylic
Potting line fully automated
Potting semi automated


Test Service:

In Circuit test  (ICT)
Functional Circuit Test (FCT)
Custom Industrialized test gear
Burn in Testing
Thermal Shock Testing
J Tag testing
Automated optical Inspection (AOI)
X-Ray


Support operations:

Final Assembly
Box Build
Cable Assembly
Depot repair operation for aftermarket services
BGA repair service